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#1 |
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Administrator
bit-tech Staff
Join Date: Dec 2011
Posts: 1,009
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GlobalFoundries announces TSV tech on 20nm
GlobalFoundries has announced it will offer through-silicon via (TSV) production at the 20nm node.
http://www.bit-tech.net/news/hardwar...ies-tsv-20nm/1 |
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Ultramodder
Join Date: Sep 2007
Location: England
Posts: 1,149
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I can see why they abbreviate it, 'through-silicon via' is one of the worst descriptions I've ever seen! Is there likely to be much demand for TSV soon? I would have thought it introduced more complications into chip design.
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#3 | |
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Supermodder
Join Date: Jan 2010
Posts: 344
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Quote:
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#4 |
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Minimodder
Join Date: Apr 2012
Posts: 38
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Actually the vias can can connect to anything. When you stack two devices you can only reach the top layer of bottom device but with TSV you can implement a bus, not unlike the busses on PCB, that multiple devices can attach to (for example the PCI-e hub, the CPU, the graphics core and the memory for the latter two could all be packaged in a single stack, taking up much less surface area, thermals permitting).
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#5 |
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Hey, ho, pip and dandy moment's...
Join Date: Jun 2010
Location: shropshire
Posts: 3,710
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And the Yields will be big Q
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