3D CPUs to speed computing - bit-tech.net Forums

Da Dego · 7th Dec 2007, 14:07

http://www.bit-tech.net/news/2007/12...ed_computing/1

The Institute of Microelectronics in Singapore and flash memory maker, Fujio Masouka, are claiming huge increases in processing power by making processors in 3D.

TreeDude · 7th Dec 2007, 14:13

I feel the heatsinks for these would be interesting.

Redbeaver · 7th Dec 2007, 14:22

need for speed of course............

Djizasse · 7th Dec 2007, 16:19

Quote:

Originally Posted by TreeDude

I feel the heatsinks for these would be interesting.

That was my first thought

Was also thinking how the socket would be, 6 sided socket connection, with channels for cooling?

chrisb2e9 · 7th Dec 2007, 16:48

picture needing enough room for 5 tuniq towers. one for each side. maybe a mini version of each...

DarkLord7854 · 7th Dec 2007, 19:31

Quote:

Originally Posted by TreeDude

I feel the heatsinks for these would be interesting.

Haha.. I read article and was trying to figure out how it would work in any manner of high efficiency

woodshop · 7th Dec 2007, 19:54

Does this mean we might be getting Processors that are spears with wire jacks on them?

DarkLord7854 · 7th Dec 2007, 20:05

Quote:

Originally Posted by woodshop

Does this mean we might be getting Processors that are spears with wire jacks on them?

The Allspark....

Cupboard · 7th Dec 2007, 20:24

Providing that the processors aren't hugely 3D, I see know reason why the cooling would have to change much. After all, current processors are multi layered, and these new ones should be more power efficient. Though I have to admit, the mental image of a processor set up like a mini nuclear reactor with cooling running through it is quite cool...

proxess · 7th Dec 2007, 20:46

It won't last long, we'll find something even better in 10 years. All we need is a giant to take a step forward.

wuyanxu · 7th Dec 2007, 22:28

the processor isn't 3D....... (i know i can't take a joke)

they basically says the gates can be overlapped, so opposed to traditional 1 layer of transistors, they can now have multi-layered, so have multiple times the original building space, thus 100MB cache on a CPU may become possible with the current manufacturing technology.

DXR_13KE · 8th Dec 2007, 12:51

if intel or amd don't pick this up i bet via or any other small cpu maker will pinch this technology and become a serious cpu maker rapist....
imagine a cell processor with this, or IBM snatching this and making God like cpus...

Ramble · 8th Dec 2007, 22:52

I read the Intel tech on this about 3 or 4 years ago. It was a bad idea then and it's a bad idea now. There is no way the heat would be dissipated fast enough.

serialnuber2012 · 9th Dec 2007, 00:50

somebody better get out and patent the trademark, "cinderblock" or something... it almost seems like an obvious name for a 3d cpu. "The Cinderblock Tephra -- with pyroclastic flow technology!"

(Tephra is air-fall material produced by a volcanic eruption regardless of composition or fragment size. Tephra is typically rhyolitic in composition as most explosive volcanoes are the product of the more viscous felsic or high silica magmas.)

RotoSequence · 9th Dec 2007, 00:53

Unless I completely missed the boat, the rest of you have. The article isn't (primarily?) about stacking transistors on top of each other, its about changing their functional orientation. At present, the structure of a transistor is a three dimensional mass of columns and other micro-silicon based structures that have varying electrical properties that allow for them to function as the transistors that make up logic circuits. So far as I can tell, all they are doing is changing the basic orientation so that instead of the silicate layers needed to make the transistors being stacked on top of each other, they're piled next to each other, with the "wires" following the typical design methods of today's processors.

Or am I horribly horribly wrong?

Amon · 9th Dec 2007, 02:16

I'm baffled how chipmakers didn't come up with and apply this before... I had an idea exactly like this (staggered vertical arrangement of transistors) to reduce die size as transistor counts began to increase dramatically around the the time of K8. I find die size to be particularly important for video cards rather than processors as they have not yet adopted widespread use of multiple graphics cores on one card rather than one gigantic and powerful one. Besides, transistor size isn't getting smaller as quick as it used to, so this sort of arrangement of transistors will have to be adopted soon enough.

liquid_gen · 9th Dec 2007, 13:41

Quote:

Originally Posted by Ramble

I read the Intel tech on this about 3 or 4 years ago. It was a bad idea then and it's a bad idea now. There is no way the heat would be dissipated fast enough.

I agree, I think heat would be a serious bottleneck for this technology. I think that however you increase speed, you're going to increase temperature and this is already the biggest limiting factor.

[USRF]Obiwan · 10th Dec 2007, 10:09

ehm....

ou7blaze · 11th Dec 2007, 15:18

I have a need for speed and also a need to pay the bills.

Sadly those two can't exist together so I'll go and cry in the corner now

7th Dec 2007, 14:07	#1
Da Dego Brett Thomas Join Date: Aug 2004 Location: Cleveland, OH USA Posts: 3,906	3D CPUs to speed computing http://www.bit-tech.net/news/2007/12...ed_computing/1 The Institute of Microelectronics in Singapore and flash memory maker, Fujio Masouka, are claiming huge increases in processing power by making processors in 3D. __________________ "Frankly that seems overkill. iluvtrees2 arguing with spec is the intellectual equivalent of a bunny rabbit taking on a pissed-off lion." - Nexxo

7th Dec 2007, 14:22	#3
Redbeaver Hypermodder Join Date: Feb 2006 Location: Ontario, CANADA Posts: 718	need for speed of course............ __________________ Monita DFI NF4 Expert - X2 3800+ 2.925Ghz - 2x1Gb OCZ Gold XTC DDR500 - 2x eVGA 7900GT SLI - 2x80Gb Seagate 7200.9 [RAID-0 4k] - Enermax Liberty 500 - Vista Ultimate x86 - Silverstone Kublai [Modded] Keisha DFI BloodIron P35 - Q6600 3.6Ghz - 4x1Gb OCZ Gold XTC2 DDR2-800 - eVGA 8800GTS 640MB - 2x80Gb Seagate 7200.9 [RAID-0 4k] - OCZ GameXstream 700 - Vista Ultimate x86 - Silverstone TJ-06 [Modded] www.pecelayam.com

7th Dec 2007, 16:48	#5
chrisb2e9 Dont do that... Join Date: Jun 2007 Location: Alberta, Canada Posts: 3,068	picture needing enough room for 5 tuniq towers. one for each side. maybe a mini version of each... __________________ attack life, it's going to kill you anyway. Long-term relationships are like urban tomatoes: they only grow under special conditions. - Prestidigitweeze Don't hold on to the reigns once you've fallen off the horse, your just going to get dragged to death - SNiiPE_DoGG

7th Dec 2007, 20:24	#9
Cupboard I'm not a modder. Join Date: Jan 2007 Location: Bury St Edmunds/Durham Uni Posts: 1,840	Providing that the processors aren't hugely 3D, I see know reason why the cooling would have to change much. After all, current processors are multi layered, and these new ones should be more power efficient. Though I have to admit, the mental image of a processor set up like a mini nuclear reactor with cooling running through it is quite cool... __________________ i7 920, 8800GTS 512, 6GB Corsair all in an Intel DX58SO; 3*320GB RAID5; CM Stacker Samsung Q45.

7th Dec 2007, 20:46	#10
proxess Victim of AdvancedModernCapitalism Join Date: Nov 2006 Location: The town of Love, Funchal Posts: 597	It won't last long, we'll find something even better in 10 years. All we need is a giant to take a step forward. __________________ Netbook: Asus eeePC 901; 12Gb SDD; Custom Ubuntu 9.04 Minimal Compiz Standalone. Laptop: Intel Centrino Duo T5500 1.66ghz; 2048mb RAM; ATI Mobility Radeon x2300; Hitachi 120gb iPod Classic 120GB; Maxtor 160GB External; Ubuntu 9.10 x64 and Windows 7 x64.

7th Dec 2007, 14:13	#2
TreeDude Multimodder Join Date: May 2007 Posts: 238	I feel the heatsinks for these would be interesting.

7th Dec 2007, 19:54	#7
woodshop UnSeenly Join Date: Oct 2003 Location: The Depths Of Hades Posts: 1,379	Does this mean we might be getting Processors that are spears with wire jacks on them?

7th Dec 2007, 22:28	#11
wuyanxu quad fuelled, GTX200 powered Join Date: Aug 2007 Location: in a room near Soton Uni. UK Posts: 3,938	the processor isn't 3D....... (i know i can't take a joke) they basically says the gates can be overlapped, so opposed to traditional 1 layer of transistors, they can now have multi-layered, so have multiple times the original building space, thus 100MB cache on a CPU may become possible with the current manufacturing technology. __________________ Death to consolification !!!Core i7 860 @ 4Ghz Cooled by Corsair H50 // Asus P7P55D Deluxe // 8GB of Corsair Dominators @ 1528Mhz 8-8-8-24 // BFG gtx260+ OC2 MaxCore 216SP 896MB // Samsung 64GB SSD // WD Raptor 74GB + Black 1TB + Green 1TB // Corsair Hx620w // Antec p182 // Samsung 24" T240

8th Dec 2007, 12:51	#12
DXR_13KE Madeira's banana is the best!!! Join Date: Sep 2005 Location: Madeira ; Portugal Posts: 6,461	if intel or amd don't pick this up i bet via or any other small cpu maker will pinch this technology and become a serious cpu maker rapist.... imagine a cell processor with this, or IBM snatching this and making God like cpus... __________________ *Renegade X - 0.40 Release!* <---- CLICK!

8th Dec 2007, 22:52	#13
Ramble Ginger Nut Join Date: Dec 2005 Location: Exeter, Devon/Wantage, Oxfordshire Posts: 5,233	I read the Intel tech on this about 3 or 4 years ago. It was a bad idea then and it's a bad idea now. There is no way the heat would be dissipated fast enough. __________________ Kirk, Spock, McCoy, and Ensign Ricky are beaming down to the planet. Guess who's not coming back.

9th Dec 2007, 00:50	#14
serialnuber2012 \/\/ho-isky Join Date: Aug 2007 Location: ATL,GA Posts: 13	somebody better get out and patent the trademark, "cinderblock" or something... it almost seems like an obvious name for a 3d cpu. "The Cinderblock Tephra -- with pyroclastic flow technology!" (Tephra is air-fall material produced by a volcanic eruption regardless of composition or fragment size. Tephra is typically rhyolitic in composition as most explosive volcanoes are the product of the more viscous felsic or high silica magmas.) __________________ CoolerMaster Stacker 830, (12in NEON LIGHT, 2 Extra Neon Light LED Case Fans), Thermaltake ToughPower 750W, Asus Striker Extreme Mobo, Intel® Core™ 2 Quad Q6600 @ 2.4GHz 1066FSB (ehhh, for now...), Vigor Gaming Monsoon II Lite CPU heatsink, (2x1GB) PC6400 DDR2/800 Dual Channel Memory Mushkin Xtreme w/ Heat Spreader, e-GeForce 8800 GTX Superclocked, X-FI XtremeGamer Fatal1ty Pro PCI Sound Card, 250GB SATA-II 7200RPM HDD, LiteOn20X&SONY16X, Pro Wiring & Thermal Compound, Vista 32

9th Dec 2007, 00:53	#15
RotoSequence Lazy Lurker Join Date: Jan 2004 Location: 'States Posts: 4,527	Unless I completely missed the boat, the rest of you have. The article isn't (primarily?) about stacking transistors on top of each other, its about changing their functional orientation. At present, the structure of a transistor is a three dimensional mass of columns and other micro-silicon based structures that have varying electrical properties that allow for them to function as the transistors that make up logic circuits. So far as I can tell, all they are doing is changing the basic orientation so that instead of the silicate layers needed to make the transistors being stacked on top of each other, they're piled next to each other, with the "wires" following the typical design methods of today's processors. Or am I horribly horribly wrong? __________________ Technology Schmecnology

9th Dec 2007, 02:16	#16
Amon inch-perfect Join Date: Jun 2007 Location: cannoning into the reds, Toronto, Canada Posts: 2,456	I'm baffled how chipmakers didn't come up with and apply this before... I had an idea exactly like this (staggered vertical arrangement of transistors) to reduce die size as transistor counts began to increase dramatically around the the time of K8. I find die size to be particularly important for video cards rather than processors as they have not yet adopted widespread use of multiple graphics cores on one card rather than one gigantic and powerful one. Besides, transistor size isn't getting smaller as quick as it used to, so this sort of arrangement of transistors will have to be adopted soon enough. __________________ Defunct Socket 939 San Diego 4000+::2GB PC3200::Radeon 9600 SE 128MB::200GB HDD::24" Dell 2407WFP-HC::WinXP x64/x86 dual boot Dell Vostro 1500 laptop::Socket P Merom T7100::2GB PC5400::Go 8600m GT 256MB::660GB HDD::15.4" WXGA+, 24" Dell 2407WFP-HC::WinXP::Fanatec 911 Wheel+Pedals

10th Dec 2007, 10:09	#18
[USRF]Obiwan Ultramodder Join Date: Apr 2003 Location: Netherlands Posts: 1,218	ehm.... __________________ Mascleta: "The most accurate simulation of thunder, humans can simulate..." The answer is 42, so... whats the question again? If you know what 'Peek' and 'Poke' represents, then you are probably as old as me.

11th Dec 2007, 15:18	#19
ou7blaze sensational. Join Date: May 2003 Location: Kowloon, Hong Kong. Posts: 2,624	I have a need for speed and also a need to pay the bills. Sadly those two can't exist together so I'll go and cry in the corner now __________________ █▓▒▒▓█▓▒▒▓█▓▒▒▓█▓▒▒▓ Originally Posted by Greeneyedguy advice to all u masturbators... its a good idea to keep a pringles can with the bottom cut out next to u so u can put it over ur wang when ur parents come and tell em u were enjoyong some delicious low-fat potato chips...