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Old 27th Jan 2012, 15:47   #1
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Micron's Hybrid Memory Cubes win tech award

Micron's three-dimensional Hybrid Memory Cube technology has won it an award from The Linley Group.

http://www.bit-tech.net/news/hardwar...mc-win-award/1
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Old 27th Jan 2012, 17:12   #2
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This doesn't sound remotely like FINFET technology (Intel's trigate transisters). One is a 3 dimensional interconnect instead of being planar (2d interconnect). This is actual interconnects BETWEEN transitors, not within the transistor itself (which is what FINFET is all about).
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Old 27th Jan 2012, 17:29   #3
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Originally Posted by azazel1024 View Post
This doesn't sound remotely like FINFET technology (Intel's trigate transisters). One is a 3 dimensional interconnect instead of being planar (2d interconnect). This is actual interconnects BETWEEN transitors, not within the transistor itself (which is what FINFET is all about).
Which is why I said it was "not dissimilar," rather than "exactly the same." Both are about extending things which are usually two dimensional into the third dimension.
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Old 28th Jan 2012, 16:02   #4
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Old 28th Jan 2012, 17:08   #5
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azazel1024 is correct though, tri-gate transistors and stacked dies do have very little in common.
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Old 29th Jan 2012, 12:57   #6
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Quote:
Originally Posted by azazel1024 View Post
This doesn't sound remotely like FINFET technology (Intel's trigate transisters). One is a 3 dimensional interconnect instead of being planar (2d interconnect). This is actual interconnects BETWEEN transitors, not within the transistor itself (which is what FINFET is all about).
Which is why I said it was "not dissimilar," rather than "exactly the same." Both are about extending things which are usually two dimensional into the third dimension.
That is the only way in which they are similar, though. By the very same logic, you could add 3D printing to the list. In fact, it seems as though 3D printing is actually a superior analogy to use!
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Old 30th Jan 2012, 09:09   #7
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That is the only way in which they are similar, though. By the very same logic, you could add 3D printing to the list. In fact, it seems as though 3D printing is actually a superior analogy to use!
Sure, that's a superior analogy - if you ignore the fact that it's about improving computing power and performance by extending things which are traditionally two dimensional (either the transistors themselves in tri-gate or arrays of transistors in HMC) into the third dimension. Then 3D printing is a pretty poor analogy, wouldn't you say?
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Old 30th Jan 2012, 12:07   #8
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Originally Posted by Gareth Halfacree View Post
Sure, that's a superior analogy - if you ignore the fact that it's about improving computing power and performance by extending things which are traditionally two dimensional (either the transistors themselves in tri-gate or arrays of transistors in HMC) into the third dimension. Then 3D printing is a pretty poor analogy, wouldn't you say?
Not particularly. There have been many attempts to improve computing power by integrating 2d packages into 3d.

The Apple processors for example have several dies inside, mounted atop each other, in order to reduce space - using what I can only assume is a similar method (might not be, but the article is unclear).


With 3D printing, layers are often printed atop each other, with chemical bonds joining the layers together, improving the process.

If you consider your exact wording,
Quote:
vertical conduits that allow components to be connected in a three dimensional mesh, in a way not dissimilar to Intel's tri-gate transistor technology
you can see that your comparison is not correct, with the technologies being different. Tri-gate transistors are three dimensional, sure, but I fail to see the vertical conduits linking layers of silicon you speak of in their production process.
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Old 30th Jan 2012, 12:11   #9
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If you consider your exact wording, [...] you can see that your comparison is not correct, with the technologies being different.
Okay, my wording was unclear: I didn't meant to infer that tri-gate uses TSV (although I can see how it reads that way,) but simply that tri-gate is another example of 2D-to-3D in chipmaking. In retrospect, it'd have been much clearer as a separate sentence: "Another example of chipmakers taking a 2D technology and expanding it to the third dimension is..."
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