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Old 27th Apr 2012, 11:11   #1
brumgrunt
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GlobalFoundries announces TSV tech on 20nm

GlobalFoundries has announced it will offer through-silicon via (TSV) production at the 20nm node.

http://www.bit-tech.net/news/hardwar...ies-tsv-20nm/1
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Old 27th Apr 2012, 12:00   #2
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I can see why they abbreviate it, 'through-silicon via' is one of the worst descriptions I've ever seen! Is there likely to be much demand for TSV soon? I would have thought it introduced more complications into chip design.
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Old 27th Apr 2012, 13:23   #3
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Quote:
Originally Posted by Bede
I can see why they abbreviate it, 'through-silicon via' is one of the worst descriptions I've ever seen! Is there likely to be much demand for TSV soon? I would have thought it introduced more complications into chip design.
What would you call it? Seems perfectly simple to me, a via which goes through the silicon. I am assuming these via are used to connect to the "system" under the silicone and not to other layers within the silicon.
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Old 27th Apr 2012, 14:11   #4
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Actually the vias can can connect to anything. When you stack two devices you can only reach the top layer of bottom device but with TSV you can implement a bus, not unlike the busses on PCB, that multiple devices can attach to (for example the PCI-e hub, the CPU, the graphics core and the memory for the latter two could all be packaged in a single stack, taking up much less surface area, thermals permitting).
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Old 30th Apr 2012, 02:44   #5
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