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Old 9th Dec 2013, 11:08   #1
Gareth Halfacree
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Qualcomm to trial new 3D chip tech

Promises an easy route to better SoCs.
http://www.bit-tech.net/news/hardwar...omm-3d-chips/1
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3d chips, arm, cea-leti, cpu, leti, planar, processor, qualcomm, semiconductor, sequential 3d integration, snapdragon, soc, system-on-chip, through-silicon via, tsv

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