|9th Dec 2013, 11:08||#1|
Join Date: Dec 2007
Location: Bradford, UK
Qualcomm to trial new 3D chip tech
Promises an easy route to better SoCs.
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|3d chips, arm, cea-leti, cpu, leti, planar, processor, qualcomm, semiconductor, sequential 3d integration, snapdragon, soc, system-on-chip, through-silicon via, tsv|