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News Intel shows off Foveros-based Lakefield design

Discussion in 'Article Discussion' started by bit-tech, 27 Feb 2019.

  1. bit-tech

    bit-tech Supreme Overlord Lover of bit-tech Administrator

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    Read more
     
    bit-tech, 27 Feb 2019
    #1
  2. Wakka

    Wakka Yo, eat this, ya?

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    Intel:

    "Our glue is better than yours!"
     
    Wakka, 27 Feb 2019
    #2
  3. edzieba

    edzieba Virtual Realist

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    There's a massive difference between through-substrate interconnects between discrete dies, and routing internal busses through silicon containing active elements. The equivalent for AMD would be routing the SDF bus (and SCF bus for that matter) between dies without all the mucking about with GMI links, omitting the CAKEs and IFOPs entirely.
     
    edzieba, 27 Feb 2019
    #3
  4. Wakka

    Wakka Yo, eat this, ya?

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    Yeah but what about the impedance caused by the flux modulation of the intra-connect pathways on the OMG by-pass bus? It just wouldn't work.

    And that's before you even consider the side effects of CAKE and FOP'ing...
     
    Wakka, 27 Feb 2019
    #4
  5. Gareth Halfacree

    Gareth Halfacree WIIGII! Lover of bit-tech Administrator Super Moderator Moderator

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    I exhibit the primary side effect of CAKE m'self: a need to loosen my belt whenever I sit down...
     
    Gareth Halfacree, 27 Feb 2019
    #5
  6. Anfield

    Anfield Multimodder

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    Finally, the end of Banias+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++.
     
    Anfield, 27 Feb 2019
    #6
    edzieba likes this.
  7. edzieba

    edzieba Virtual Realist

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    You think you're very clever young man, but it's P6 all the way down!
     
    edzieba, 27 Feb 2019
    #7
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