Discussion in 'Article Discussion' started by bit-tech, 8 Oct 2019.
The big change is not for chip reverse-engineering (where you can afford to decap and etch/grind a whole pile of chips to analyse the structure) but in analysis of 'secure' chips designed to hold hidden data (i.e. hidden structures) and for those secure areas to 'self destruct' on attempted chip disassembly. This protection is mostly bypassed through nondestructive imaging, until structures can be developed that are directly disrupted by the X-ray intensities used during imaging, though these would also be highly vulnerable to cosmic ray damage.
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