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News GTC 2013: Nvidia unveils Volta, Parker and Faceworks tech

Discussion in 'Article Discussion' started by Gareth Halfacree, 20 Mar 2013.

  1. Gareth Halfacree

    Gareth Halfacree WIIGII! Lover of bit-tech Administrator Super Moderator Moderator

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    Gareth Halfacree, 20 Mar 2013
    #1
  2. mi1ez

    mi1ez Modder

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    Could they not put the RAM beneath the GPU? You'd need more interconnects trough it to reach the PCB, but it could alleviate potential heat issues?
     
    mi1ez, 20 Mar 2013
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  3. mi1ez

    mi1ez Modder

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    That face stuff in the video at 9mins it pretty weird. The eyes are the only real giveaway.
     
    mi1ez, 20 Mar 2013
    #3
  4. Corky42

    Corky42 Where's walle?

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    Wouldn't it be better to place the DRAM under the GPU silicon, from a heat perspective ?

    Looks like PC's will be massively held back again in 2016 with developers making games not able to take advantage of the superior hardware in PC's
     
    Corky42, 20 Mar 2013
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  5. Gareth Halfacree

    Gareth Halfacree WIIGII! Lover of bit-tech Administrator Super Moderator Moderator

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    It's possible, but then you've got the problem of the RAM overheating rather than the GPU. It would also lengthen the GPU's connection to other components on the board, which could have a deleterious effect on performance.

    In short: possibly, but every time I've seen this kind of thing done it's been processor then DRAM, not DRAM then processor (have a shufti at the Raspberry Pi for an example of last-generation non-TSV design: the SoC is beneath the DRAM chip in a package-on-package (PoP) mount), and as the designers are a lot cleverer than I I'm going to guess there's a good reason for that.
     
    Gareth Halfacree, 20 Mar 2013
    #5
  6. greigaitken

    greigaitken Minimodder

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    solved!, have board mid height of the gpu,ram stack, and have coolers on both sides. might be hard to do sli, but thats what i came up with in 60 secs for free.
     
    greigaitken, 20 Mar 2013
    #6
  7. chrisc1277

    chrisc1277 Minimodder

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    ergh! how freaky is that faceworks video! I'm impressed
     
    chrisc1277, 20 Mar 2013
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  8. Xir

    Xir Modder

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    As long as it's silicon on silicon, heat transfer should work pretty well. Also the thickness of the final package is probably not much thicker than now, the non-active part of the silicon could become thinner, than regain tensile strength when bonded/packaged
     
    Xir, 21 Mar 2013
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