News Intel badmouths AMD's Epyc design

Discussion in 'Article Discussion' started by bit-tech, 13 Jul 2017.

  1. bit-tech

    bit-tech Supreme Overlord Staff Administrator

    Joined:
    12 Mar 2001
    Posts:
    273
    Likes Received:
    8
  2. Wakka

    Wakka Yo, eat this, ya?

    Joined:
    23 Feb 2017
    Posts:
    653
    Likes Received:
    24
    That's funny, because consumers, overclockers and reviewers alike all seem to be badmouthing Intel's latest (admittedly non-server) releases...

    And with the price-per-core ratio of Epyc VS Skylake-SP, I'd wager a few people will be badmouthing those parts too.
     
  3. Maki role

    Maki role Dale you're on a roll...

    Joined:
    9 Jan 2012
    Posts:
    1,479
    Likes Received:
    30
    Did they have a slide about their thermal toothpaste they use?
     
    Omnislip and Vault-Tec like this.
  4. adidan

    adidan Too lazy to change avatars. It's always christmas.

    Joined:
    25 Mar 2009
    Posts:
    10,863
    Likes Received:
    350
    Bad move in how they expressed themselves, they may as well have said 'waaah they're stinky poo pants and it scares us'.
     
  5. RedFlames

    RedFlames ...is not a Belgian football team

    Joined:
    23 Apr 2009
    Posts:
    7,555
    Likes Received:
    274
    Intel: You don't want that... it's just 2 [or 4] CPUs glued together...

    Tech History: You mean like your early dual and quad core parts?
     
  6. TheMadDutchDude

    TheMadDutchDude Flying Dutchman

    Joined:
    23 Aug 2013
    Posts:
    3,081
    Likes Received:
    101
    Aren't Intel doing the exact same thing anyway? Just calling it a mesh rather than using what AMD is doing with their Infinity Fabric.

    Intel are just resorting to this because they know AMD has got them by the balls.
     
  7. David

    David RIP Tel

    Joined:
    7 Apr 2009
    Posts:
    11,797
    Likes Received:
    1,470
    Which is exactly what the strap line in the article said.
     
  8. yuusou

    yuusou Active Member

    Joined:
    5 Nov 2006
    Posts:
    1,164
    Likes Received:
    20
    I like how AMD just ignores this and announces Ryzen 3 and Threadripper, where Threadripper pricing is well below i9 and Ryzen 3 has 4 cores instead of 2c/4t.
     
  9. David

    David RIP Tel

    Joined:
    7 Apr 2009
    Posts:
    11,797
    Likes Received:
    1,470
    If your opponent is on his knees in the mud, why would you willingly join him?
     
  10. Wakka

    Wakka Yo, eat this, ya?

    Joined:
    23 Feb 2017
    Posts:
    653
    Likes Received:
    24
    It's funny how AMD can be running rings around Intel in terms of matching their release schedules, beating them in efficiency and value for money, but so far behind Nvidia on the GPU front... I'm really starting to suspect that they just did not have the resources and R&D manpower to fight both fronts. Hopefully now Ryzen, Epyc and Threadripper are done and ready, they can get to work on catching up in GPU development. Can you imagine what we'd paying for a GTX 1080 today if Vega was as competitive in comparison as Ryzen was compared to Kabylake?!
     
  11. adidan

    adidan Too lazy to change avatars. It's always christmas.

    Joined:
    25 Mar 2009
    Posts:
    10,863
    Likes Received:
    350
    Could well be, I'll guess we'll see in a few weeks. I'm not expecting a Ryzen-esque impact in the GPU market but if they can at least compete it's good all round. Maybe they'll then be able to throw all their weight into the GPU battle now their CPU arm is down pat. I could carry on guessing really.
     
  12. 23RO_UK

    23RO_UK Hasta Mañana

    Joined:
    4 May 2010
    Posts:
    3,583
    Likes Received:
    228
    As you've correctly stated, you never fight a war on two fronts...

    To be able to smack Intel in the love sacks is amusing enough though (and long overdue) ;)
     
  13. edzieba

    edzieba Virtual Realist

    Joined:
    14 Jan 2009
    Posts:
    1,968
    Likes Received:
    43
    Threadripper/Epyc has three separate inter-core 'tiers': inside the same CCX (fast), between CCXs on the same physical die (not very fast), and between physical dies (not fast at all).
    Skylake-SP and Skylake-X are all single-die devices. Even the 'slowest' communication latency between cores on opposite corners of the mesh is faster than inter-CCX communication.
     
Tags: Add Tags

Share This Page