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News Intel reveals Foveros 3D packaging technology

Discussion in 'Article Discussion' started by bit-tech, 12 Dec 2018.

  1. bit-tech

    bit-tech Supreme Overlord Staff Administrator

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    Read more
     
    Corky42 likes this.
  2. edzieba

    edzieba Virtual Realist

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    Not quite "it's just an interposer!", but closer to the bottom-die of a HBM or HMC stack, but scaled up.
     
  3. Corky42

    Corky42 Where's walle?

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    Steve over a GN sat down with David Kanter to talk about 3D packaging.

     
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