1. This site uses cookies. By continuing to use this site, you are agreeing to our use of cookies. Learn More.

Planning Is trespa (HPL) suitable for a case mod?

Discussion in 'Modding' started by morbid_looney, 7 Jun 2015.

  1. morbid_looney

    morbid_looney New Member

    Joined:
    27 Apr 2010
    Posts:
    22
    Likes Received:
    0
    Hi there,

    I'm in the planning and designing phase for a scratch case mod that will look like the old Connection Machine II supercomputer.

    Here is what I have on SketchUp so far:

    https://3dwarehouse.sketchup.com/model.html?id=u79aedb63-31c9-420a-9759-2559f8b1e477


    I was thinking of making it out of trespa HPL but I don't see a lot of modders using this material (or any at all) so I was wondering if there is a reason for this and If so, which material should I use?

    PS, A lot of parts will be cut using a water jet cutter and other stuff (like the back of the PC) will be milled.


    Thanks for the help!
     
  2. Spaceraver

    Spaceraver Ultralurker

    Joined:
    19 Jan 2006
    Posts:
    1,363
    Likes Received:
    5
    HPL is a mixture of paper and epoxy. I cannot see why it shouldn't be a suitable material for a case. I have ordered MFG Crosswind flight pedals in the same material, those are cut on a CNC 3 axis mill.. I don't know what will happen on a waterjet with HPL..
     
  3. morbid_looney

    morbid_looney New Member

    Joined:
    27 Apr 2010
    Posts:
    22
    Likes Received:
    0

    Thanks for the response, waterjet will not be a issue for HPL or most other types of wood, I have worked with them before and I prefer the sharp (low radius) corners it gives compared to milling.


    Anyway, I have done some more research on HPL and apparently I has a bad expansion coefficient.
    This can cause problems for me so I will probably use MDF or HDF instead.
    This can also be cut very well using a water jet cutter:
    https://youtu.be/wyPLRmpdyXQ
     

Share This Page