After much waiting I finally got to build my new system last night. The main items of concern here are: CPU: Intel Quad Q6600 (G0 Stepping) Mobo: Gigabyte EP45-UD3R Intel P45 Cooler: Akasa AK-966 (a.k.a Blue Aurora) I also utilised some arctic silver 5 thermal paste applied as specified by the manufacturer. The cooler uses a backplate into which you screw the HSF. After doing this and tightening the screws to their full tension I noticed that I could still move the HSF slightly by twisting it. It feels like it's in contact with the CPU and thermal paste, however, my question would be that is this normal for LG775 processors? In the past I've been used to AMD coolers which apply much more pressure than this. I haven't had chance to run any proper thermal tests yet (need to install an OS) but after copying some files around using the ubuntu live CD I decided to reboot to bios. The temps in there were around 35 - 37 degrees C. To me, these seem a little high, and, as I want to overclock the CPU my concern is that it's simply not going to be able to handle the heat. Anyone have any prior experience or advice for me?