Hoping some peeps might be able to shed some light on things for me... I have a i5-6600K which has been OC'd to 4.7ghz with 1.25v. Its been running nice and stable till recently. I've noticed in HWiNFO that the package temp is idling at about 49 degrees, while the cores are at 28 degrees. The package can then shoot up to 75 degrees under load where as previously it would have stayed 60 ish degrees. Am I looking at failing TIM under the IHS? I've replaced my TIM between the heat sink and HSF many times since the system was built (I've checked I didn't just muck it up last time I did it...) Will I need to de-lid and reapply the paste between silicon and IHS? Is this easy? Is this worth it? Am I barking up the wrong tree...? EDIT: The reason this has become an issue now is that the fans are constantly running as if I'm in the middle of a heavy gaming session. Where previously at idle the system was nice and silent.