I am very interested in cooling memory with Koolance's RAM-33/35 coolers. However, it is necessary to remove any factory heat spreaders to do so. Koolance recommends to only remove heat spreaders that are attached with screws, metal brackets, or thermal tape. Koolance further recommends to not remove heat spreaders that are riveted, glued, or soldered. Short of buying and attempting dissection, can I discern the glued or soldered heat spreaders from the thermal tape type on a given memory? Do particular manufacturers use one method for their entire line or is it likely to vary? Specifically, I am interested in OCZ'z Platinum 4GB Model OCZ3P1600EB4GK.
well the honeycomb heatspreaders on ocz are supposed to run 5c cooler than the closed.. it could be hype who knows, but think some guys tested it couple years back.. not sure really, but my guess is it's not glued on as they are spongy to touch
From personal experience OCZ's honeycomb heatspreaders are very hard to remove, and once removed the heatspreaders are then bent, fractured and you still have to remove the thermal glue/tape. Compared to the metal clipped heatsinks, such as http://www.newegg.com/Product/Product.aspx?Item=N82E16820104075 (just throwing random example, first ones i saw on newegg) OCZ's heatspreaders are a pain. These metal clipped ones couldn't be simpler to remove. You simply remove the 2 chrome "clamps" and the two parts of the heatspreader come off easy as cake. The thermal material generally consists of two thermal pads that do not stick to the memory. Those particular memory sticks you suggested seem to be pretty solid, and i don't doubt they are, if you did want to switch heatspreaders i wouldn't shy away from them. However in your application i'd be more apt to recommend something like http://www.newegg.com/Product/Product.aspx?Item=N82E16820146871 .
