News Researchers create new thermal material

http://www.bit-tech.net/news/hardware/2009/04/09/researchers-create-new-thermal-material/1

Researchers at IFAM in Germany create a new thermal material for cooling silicon by adding diamond powder to copper.

 

Waiting for the first £1000 HSF's to arrive!

 

My thoughts exactly. xD

 

"one-and-a-half times"

wish I could research things that give a 50% improvement to a problem that doesnt exist...

 

ever heard of the red ring of death on an xbox? caused by the heatsink...
while not a big deal on PC platforms which do not use integrated heatsinks. It can be an issue on more miniature platforms and the coefficient of thermal expansion is not something that is easily skirted around.

when I worked as an engineer at an thermal products manufacturer we constantly had to plan around the expansion of heating metals as it would literally rip 1" plate apart.

besides if it gives better performance isn't that reason enough?

 

Since when has heat dissipation NOT been a problem?

 

Forget pcs. This would probably be more use full in engineering. Jet engines, satellites, helicopters etc. all these things need as much heat dissipation as possible with minimal weight gain. They'd also be more likely to shell out the extra cash too.

 

Uh, ok. Heat dissipation and heatsink efficiency is one of the biggest problems in modern-day computing. I'm surprised that Google hasn't already bought this company, given how many datacenters they control. A HUGE amount of the costs of running datacenters is related to cooling.

 

better cooling = more powers

 

Buying the Fraunhofer Institute? What a nice idea...

On topic:

Yep, me wants [if affordable, so not yet].

 

Haha, the ultimate bling heatsinks.