Discussion in 'Article Discussion' started by bit-tech, 30 Jun 2020.
"As mentioned, the Cardea Ceramic C440 Solid State Drive uses aerospace ceramic composite cooling materials which are meant to reduce heat by 18 percent in a case equipped with a fan. It's lightweight and thin too while being all those other positive things like extreme temperature shock resistant, and offering anti-electromagnetic interference. "
The highest thermal thermal conductivity listed here for an advanced thermal ceramic is 150W/m/K as compared to 200W/m/K for aluminium and 385W/m/K for copper. I guess the surface roughness would also affect forced air flow (turbulence) but it surprises me that ceramics could offer better cooling than copper or aluminium. Any thoughts on how they might do it?
Also, can ceramics really offer anti-electromagnetic interference? I would expect that a metal would be better as a shield - most EM waves would pass straight through a non-conductive ceramic. Perhaps the claim is that metal heat sinks act as aerials, directing the interference down to the chip.
Interested to hear any other theories on either of these.
Not they don't mention "reduce[ed] heat by 18 percent in a case equipped with a fan" compared to what. The claim could remain technically correct if appended with "compared to no thermal solution at all" or "compared to the same heatsink without a fan" or "comapred to wrapping the SSD in neoprene and burying it".
Marketing claims without data to back them can and should be immediately dismissed as worthless. If such a claim had actual merit they'd be shoving graphs and test data everywhere in order to shout it from the rooftops. That they're not should be assumed to mean the numbers are merely rectally extracted until proven otherwise.
Also the "heatspreader" is supposedly only approx 1mm thick, so really more of a glorified sticker...
Edit: Just chased the patent for the "cooler" through google translate and couldn't find anything about how it is supposed to work there either.
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