News Qualcomm to trial new 3D chip tech
Discussion in 'Article Discussion' started by Gareth Halfacree, 9 Dec 2013.
Tags:
- 3d chips
- arm
- cea-leti
- cpu
- leti
- planar
- processor
- qualcomm
- semiconductor
- sequential 3d integration
- snapdragon
- soc
- system-on-chip
- through-silicon via
- tsv