BICS 2 to hit the market in 2016. http://www.bit-tech.net/news/hardware/2015/03/26/toshiba-sandisk-48-layer-bics/1
Promises an easy route to better SoCs. http://www.bit-tech.net/news/hardware/2013/12/09/qualcomm-3d-chips/1
TSV-based 3D DRAM tech heads to production. http://www.bit-tech.net/news/hardware/2013/04/03/hmc-spec/1
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