Discussion in 'Article Discussion' started by bit-tech, 7 Nov 2018.
They completely reinvented the way the cores are "glued" together and added PCIe 4...
Will be interesting to see if they actually stick to their previous promise of keeping the current sockets around up to and including 2020.
This chip looks exciting. The lack of any sort of benchmarks pre-release has me ambivalent, though... is it good or bad? Pre-Bulldozer, AMD were trumpeting benchmark results (albeit very specific ones) and how good they were... but the uarch itself turned out to be something of a misstep. So perhaps it's not a bad sign.
But I guess Rome wasn't built in a day...
That bit is weird. The footnotes are there - but all the juicy stuff is redacted. "AMD Rome with XXXXXXGB in XXXXXX DIMMs completed the C-Ray demo in XXXXXX seconds" - yeah, cheers for that, very informative(!)
When they first officially showed off Ryzen (including benchmarks) that was only 3 months before launch, so I wouldn't read too much into it just yet.
I think they learned their lesson with Bulldozer... hence no benchmarks.
It's early days, that they are already deployed in AWS is a good sign that it's functionality is there, clockspeeds may not be but probably suitable for datacentre where they are now, it is high margin there, AMD will be more interested in recouping costs before diluting the product with desktop lines I'd imagine.
They are not already deployed in AWS, to the best of my knowledge; they have not been deployed anywhere yet, nor have they even entered production. The pictured processor is a pre-production sample, one of a small number being sent to partner companies ahead of full production.
Ah I missed that bit when watching AMD video. 2+2 when not giving full attention =5
I should read article
Read the article before commenting? What radical nonsense is this?!
Off-CPU-die memory and IO controllers? The Northbridge rides again!
made me laugh and so true
The suggestion of a madman, to be sure!
At least this solves the conundrum of how AMD were going to keep buying enough wafers from GloFlo, get the 'chiplets', as AMD are calling them now, manufactured on 7nm at TSMC, and get the I/O die manufactured at GloFlo at 14nm. That last bit isn't confirmed, but it makes sense to me...
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