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News GlobalFoundries announces TSV tech on 20nm

Discussion in 'Article Discussion' started by brumgrunt, 27 Apr 2012.

  1. brumgrunt

    brumgrunt New Member

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  2. Bede

    Bede Well-Known Member

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    I can see why they abbreviate it, 'through-silicon via' is one of the worst descriptions I've ever seen! Is there likely to be much demand for TSV soon? I would have thought it introduced more complications into chip design.
     
  3. Jehla

    Jehla Member

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    What would you call it? Seems perfectly simple to me, a via which goes through the silicon. I am assuming these via are used to connect to the "system" under the silicone and not to other layers within the silicon.
     
  4. Alecto

    Alecto Member

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    Actually the vias can can connect to anything. When you stack two devices you can only reach the top layer of bottom device but with TSV you can implement a bus, not unlike the busses on PCB, that multiple devices can attach to (for example the PCI-e hub, the CPU, the graphics core and the memory for the latter two could all be packaged in a single stack, taking up much less surface area, thermals permitting).
     
  5. penryn 2 hertz

    penryn 2 hertz I'm not a science fiction writer...

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    And the Yields will be big Q
     
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