Discussion in 'Article Discussion' started by bit-tech, 27 Feb 2019.
"Our glue is better than yours!"
There's a massive difference between through-substrate interconnects between discrete dies, and routing internal busses through silicon containing active elements. The equivalent for AMD would be routing the SDF bus (and SCF bus for that matter) between dies without all the mucking about with GMI links, omitting the CAKEs and IFOPs entirely.
Yeah but what about the impedance caused by the flux modulation of the intra-connect pathways on the OMG by-pass bus? It just wouldn't work.
And that's before you even consider the side effects of CAKE and FOP'ing...
I exhibit the primary side effect of CAKE m'self: a need to loosen my belt whenever I sit down...
Finally, the end of Banias+++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++++.
You think you're very clever young man, but it's P6 all the way down!
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