Discussion in 'Article Discussion' started by bit-tech, 24 Feb 2020.
Air bubble in the CPU block would do my nut in, I can't help but feel that tilting the case would of got rid of that and maybe had a positive effect on the cooling?
Unless you go to ridiculous extremes you can ignore the entire debate around the amount and application method of thermal paste.
Just make absolutely sure you never show or tell anyone how you do it.
(Because people are immune to test results that prove the debate is BS and attack you regardless).
I'm pretty sure that particular air bubble will have only aesthetic effects. The CPU block Corsair designed has a lot of extra space in it, and Mister Bubble is nowhere near the heat transfer fins. So that bubble's got a pretty small surface area to work with, and it isn't directly over the die. (I think the area the bubble is in only even exists for aesthetic purposes, making the bubble's refusal to leave it actually kinda funny)
But yeah, laying the case on its side for a couple seconds would get that air out and flood the entire chamber like nobody's business. Surprisingly, it actually purged itself the first time the loop was filled, before they added the video block. It may decide to leave with a power cycle.
this... /\ with huge bells, and golden chimes and all sorts of lighting, and singing angels.
Few people agree... and fewer still with my way @MLyons
The air bubble didn't appear to be their when it was just the CPU block, so wouldn't have had any affect on the results. But yeh that would do my head in too. Spent half an hour chasing bubbles out a GPU block the other week. Little ******* kept popping back in every time I thought I'd clear him.
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